74AUP2G125RA3-7: Pinout, Package, and Procurement Checks

74AUP2G125RA3-7 is a DIODES dual non-inverting buffer with independently controlled three-state outputs. Each channel passes its input to its output when its output-enable input is LOW; a HIGH enable input places that output in a high-impedance state. The device operates from a 0.8 V to 3.6 V supply. [2]

For purchasing, confirming the complete part number is the starting point. A useful review also checks enable polarity, pin mapping, electrical limits under the intended conditions, PCB compatibility, and the actual packing being offered. This guide brings those checks together for the specific RA3 ordering option.

1. Confirm the Function and Output-Enable Polarity

The manufacturer product-page heading includes “OE HIGH,” but the page description and datasheet function table establish that HIGH disables the output. Read the behavior itself rather than interpreting that short heading as active-HIGH enable. [1] [2]

In a design review, ask which circuit drives each enable input and what state is required during reset. A shared-bus review should also establish who controls the line while this buffer is disabled. “Z” must not be treated as a driven logic HIGH or LOW.

If an alternative is proposed, make enable behavior a separate approval item. A similar name or a description containing “buffer” is insufficient evidence of equivalent operation.

2. Verify the Pinout Against the PCB

The following pin assignments refer to the manufacturer's X2-DFN1210-8 device. Use the original top-view drawing to confirm orientation. [1]

The channel outputs appear at different positions in the pin sequence. Compare every net with the schematic rather than assuming that nearby pin numbers form a complete channel. Include the pin-1 indicator, footprint rotation, and assembly drawing in the same check.

For an unused channel, engineering should define the input and enable connections. The datasheet instructs that unused inputs be held at VCC or ground. [1] Do not let an informal purchasing substitution introduce a different pin assignment into an already released PCB.

3. Read Electrical Limits with Their Conditions

A catalog headline cannot replace the relevant electrical table. Before approval, write down the intended supply, receiving-device thresholds, output loading, ambient range, and timing budget. Then select the matching manufacturer rows.

For output-level compatibility, compare the selected VOH and VOL limits with the receiver's required VIH and VIL, allowing the margin required by the project. These are separate checks from whether the supply voltage is acceptable.

A current figure also needs its voltage and output-level conditions. If the actual load differs, engineering must select another applicable row or obtain clarification. Do not turn a single drive-current headline into a promise of the same performance at every supply voltage.

Check Load and Temperature When Reviewing Timing

Illustrative screening example: suppose a project allocates 6.0 ns to this device's propagation delay. Under the cited test conditions, the lower-load maximum is below that allowance, while the higher-load maximum exceeds it. This calculation is an initial comparison, not validation of a board. The engineer must establish the actual load, input conditions, and remaining system margins.

Also review enable and disable timing separately when the control path matters. A data-path delay alone does not describe the complete handover of a shared signal. The typical column should not replace a maximum limit in a worst-case timing budget.

4. Match the RA3 Package to the Land Pattern

The RA3 option uses X2-DFN1210-8. The separate manufacturer package drawing gives typical body dimensions D = 1.20 mm and E = 1.00 mm, typical pitch e = 0.30 mm, and maximum height A = 0.35 mm. [1] [3]

Use those dimensions to identify the drawing, then compare the terminal geometry, tolerances, orientation, and suggested land pattern with the released footprint. Body length and width alone cannot establish assembly compatibility.

The manufacturer describes its suggested land pattern as a reference that may need adjustment for fabrication criteria or equipment capability. [3] The assembly team should therefore approve the production footprint and process requirements rather than relying on a generic DFN category.

Keep the drawing revision or retrieval date with the review. If a supplier lists a broader package description, request confirmation of the exact manufacturer package instead of assuming that the category name contains all the necessary detail.

5. Review Powered-Down Operation as a Separate Requirement

DIODES identifies IOFF support for partial-power-down applications on the product page. [2] For a system in which another device can drive a signal while this buffer's supply is off, include that state explicitly in the engineering review.

Record which pins remain driven, their voltage range, the supply state, and the acceptable leakage. Then consult the applicable IOFF and voltage-limit rows. A steady-state leakage specification should not be expanded into an unconditional guarantee for every power sequence or hot-plug event.

This check should remain visible in any proposed replacement review. Purchasing can collect the documents and operating requirements; engineering should decide whether the evidence covers the actual system behavior.

6. Separate the Ordering Code from the Offered Packing

The ordering row for 74AUP2G125RA3-7 specifies 7-inch tape and reel, with 5,000 devices per reel. [1] This is a manufacturer packing specification, not a statement of current CST inventory.

Ask whether the actual offer is an original full reel, a partial reel, or cut tape. Confirm quantity per packing unit, any split quantities, available labels, and the packing condition required for your assembly process. Put the agreed delivery format in the quotation and purchase order.

If the offered code includes an additional reference or suffix, preserve it until its relationship to the requested ordering code is documented. Our DIODES part-number and ordering-suffix guide explains how to distinguish external part numbers, internal references, and unresolved differences.

7. Check Change Notices and Lot Evidence

Open the current manufacturer product page and review the linked notices before release. DIODES states that a notice linked to a device family may apply only to particular orderable part numbers. Check the original notice's scope and affected list, then relate any applicable change to the offered material. [2]

One relevant label example is PCN-2770 Rev. 2. It describes adding fab-site, country-of-diffusion, and assembly-site-origin information to product and shipping labels. The notice covers all DIODES products and says that existing standard labels continue shipping until their supply is exhausted; it states no change to product form, fit, or function. [4]

Consequently, a label-layout difference needs review against the applicable notice and label specification. It should not automatically decide acceptance or rejection. Keep the actual label images and explanations with the quotation review.

A date code, a label, or a general supplier certificate answers only part of a purchasing question. Establish which documents are required, who issues them, and how they relate to the delivered quantity. Confirm any current lifecycle or availability statement separately rather than inferring it from the existence of a datasheet.

8. Prepare an RFQ That Can Be Checked and Quoted

For a quotation, visit the CST product page for 74AUP2G125RA3-7 or email your requirements to ziven.wu@cstcomponents.com. Actual availability, quantity, packing, supporting documents, and dispatch timing should be confirmed for the offer.

For related requirements, browse the CST DIODES product range or use the contact page.

Frequently Asked Questions

Does HIGH on OE enable the buffer?

No. The function table shows HIGH selecting the high-impedance state. Use the table when reviewing the control circuit. [1]

Is an eight-pin DFN description enough to approve a purchase?

No. Match the complete ordering code, manufacturer package drawing, pin assignment, and approved footprint. A broad package category is useful for searching but insufficient for release.

Can another device with 125 in its name be substituted?

Treat it as a candidate requiring review. Compare the complete devices for channels, enables, pins, electrical limits, timing, powered-down behavior, package, and required qualification. Obtain engineering approval before changing the order.

Manufacturer References

Sources reviewed October 28, 2026. Numerical examples refer to the stated datasheet revision. Recheck applicable current information before a production order.

1. DIODES 74AUP2G125 datasheet, DS36144 Rev. 1-2, January 2015; ordering and pins, page 2; operating conditions and DC limits, pages 3-5; switching and measurement conditions, pages 7-9.

2. DIODES 74AUP2G125 product page; device description and PCN links. The description and PDF function table clarify the enable behavior.

3. DIODES X2-DFN1210-8 package drawing, May 24, 2016; outline dimensions and suggested pad layout.

4. DIODES PCN-2770 Rev. 2, cover letter dated May 22, 2026; product and shipping label changes.